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2011-Sustainable Industrial Processing Summit
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| Editors: | Florian K |
| Publisher: | Flogen Star OUTREACH |
| Publication Year: | 2012 |
| Pages: | 646 pages |
| ISBN: | 978-0-9879917-6-8 |
| ISSN: | 2291-1227 (Metals and Materials Processing in a Clean Environment Series) |
Enhancement Of Thermal Conductivity Of Polymer And Rubber Nanocomposites
Richard Partch1; David Gervasi2; James Touchette1; Matthew Kelly2;1CLARKSON UNIVERSITY, Potsdam, United States; 2XEROX CORPORATION, Webster, United States;
Type of Paper: Regular
Id Paper: 529
Topic: 9
Abstract:
The information reported in this presentation pertains to improving the thermal conductivity of photo and thermally cured poylmeric materials using nanoparticle fillers. Historically, some ceramics and most polymers and rubbers have very low thermal flux capability and small enhancements in that property have been made by incorporating some inorganic or metallic fillers.A specific application that can benefit from the present research is increasing the thermal conductivity of silicone and fluoroelastomer rubbers coated on thermal fusion rollers in copy machines. Fillers examined include several morphologies and sizes of metallic particles, several types of carbon particles, one nitride and one carbide type of particles, for comparison with aluminum oxide. Regardless of filler type, particles must be well dispersed in the pre-cured resins, which property can be improved by coating the filler particles with an interfacial material compatible with the matrix. It will be shown that such core-shell fillers can induce better thermal conductivity than the cores alone.